Laser based splitting method, object to be split, and semiconductor element chip
US7211526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2005 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Feb 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.