Method for manufacturing double-sided flexible printed board
US7213334B2 · kind B2 · utility
1Cited by
5References
6Claims
0Family size
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Key dates
| Filing date | Dec 16, 2003 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | May 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to form a polyimide insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.