Patent · US Expired

Micromechanical sensor

US7213465B2 · kind B2 · utility

7Cited by

2References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Hubert Benzel · Neckartenzlingen, DE
Frank Schaefer · Lörrach, DE
Christoph Schelling · Stuttgart, DE

Key dates

Filing date	Oct 4, 2004
Grant date	May 8, 2007
Priority date	—
Expiry date	Oct 4, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.