Underfill fluxing curative
US7213739B2 · kind B2 · utility
9Cited by
10References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | May 29, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.