Positively photosensitive insulating resin composition and cured object obtained therefrom
US7214454B2 · kind B2 · utility
5Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0236
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent. The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.