Photosensitive resin composition and process for producing heat-resistant resin film
US7214455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2003 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling point at atmospheric pressure of 100° C. or higher and 140° C. or lower, the content of the component (c) being 50% by weight or more and 100% by weight or less based on the total amount of the organic solvent, and to a process for producing a heat-resistant resin film using the same. According to the present invention, there is provided a photosensitive resin composition which is less likely to cause defects such as transcribed trace and line drawing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.