Apparatus incorporating small-feature-size and large-feature-size components and method for making same

US7214569B2 · kind B2 · utility

Assignee

• Alien Technology Corporation · US

Inventors

• Susan Swindlehurst · Redwood City, US
• Mark A. Hadley · Newark, US
• Paul S. Drzaic · Olivehurst, US
• Gordon S. W. Craig · Palo Alto, US
• Glenn Gengel · Hollister, US
• Scott Hermann · Hollister, US
• Aly Tootoochi · San Jose, US
• Randolph Eisenhardt · Prunedale, US

Key dates

• Filing date: Jan 30, 2004
• Grant date: May 8, 2007
• Expiry date: Jan 30, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D62/117
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.