Susan Swindlehurst
8Patents
6h-index
23Co-inventors
63Inventor score
Filing activity: Jan 22, 1999 → Sep 8, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6011314A | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Electricity | 104 | Expired |
| US7214569B2 | Apparatus incorporating small-feature-size and large-feature-size components and method for making same | Electricity | 64 | Expired |
| US7615479B1 | Assembly comprising functional block deposited therein | Emerging Cross-Sectional Technologies | 56 | Expired |
| US7576656B2 | Apparatuses and methods for high speed bonding | Electricity | 51 | Active |
| US6085968A | Solder retention ring for improved solder bump formation | Electricity | 24 | Expired |
| US6146984A | Method and structure for uniform height solder bumps on a semiconductor wafer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6268656A | Method and structure for uniform height solder bumps on a semiconductor wafer | Emerging Cross-Sectional Technologies | 6 | Expired |
| US12225336B1 | Systems and methods to secure fabric to speaker-based devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.