Patent · US Expired

Device for packing electronic components using injection molding technology

US7215010B2 · kind B2 · utility

4Cited by

8References

38Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ulrich Bast · Birkenfeld, DE
Georg Ernst · Thalmässing, DE
Thomas Zeiler · Nittendorf, DE
Matthias Oechsner · Wetter (Ruhr), DE

Key dates

Filing date	Mar 2, 2001
Grant date	May 8, 2007
Priority date	—
Expiry date	Jun 20, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3) has interconnects (5) with contact terminal areas (6) for connecting to contact areas (7) of the electronic components (1) and contact vias (8) to external contacts on a second side (10) of the leadframe (3). In this case, the leadframe (3) includes a ceramic substrate (11) with a first side (2) having edge regions (12) configured with a ductile, annular metal layer (13).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.