Multi-die module
US7215022B2 · kind B2 · utility
7Cited by
31References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2001 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jun 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.