Vincent Chan
16Patents
7h-index
8Co-inventors
59Inventor score
Filing activity: Mar 9, 1978 → Feb 1, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7015826B1 | Method and apparatus for sensing and transmitting a body characteristic of a host | Electricity | 191 | Expired |
| US7670939B2 | Semiconductor chip bump connection apparatus and method | Electricity | 55 | Active |
| US6849940B1 | Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same | Electricity | 24 | Expired |
| US7432825B2 | Interrogation device and method for scanning | Electricity | 11 | Expired |
| US6929976B2 | Multi-die module and method thereof | Electricity | 10 | Expired |
| US7799608B2 | Die stacking apparatus and method | Electricity | 8 | Active |
| US8120170B2 | Integrated package circuit with stiffener | Electricity | 8 | Active |
| US7215022B2 | Multi-die module | Electricity | 7 | Expired |
| US7985621B2 | Method and apparatus for making semiconductor packages | Electricity | 7 | Active |
| US6798667B2 | Solder ball collapse control apparatus and method thereof | Emerging Cross-Sectional Technologies | 7 | Expired |
| US8847383B2 | Integrated circuit package strip with stiffener | Electricity | 4 | Active |
| US4190792A | Positioning control system | Physics | 3 | Expired |
| US8378471B2 | Semiconductor chip bump connection apparatus and method | Electricity | 1 | Active |
| US7969020B2 | Die stacking apparatus and method | Electricity | 1 | Active |
| US7914648B2 | Device for web control having a plurality of surface features | Textiles; Paper | 1 | Active |
| US8637391B2 | Flip chip semiconductor assembly with variable volume solder bumps | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.