Surface acoustic wave device, package for the device, and method of fabricating the device
US7215065B2 · kind B2 · utility
2Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jun 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, a package housing the surface acoustic wave chip, and electrode patterns provided on a bottom surface of the package. The bottom surface of the package is wider than a top surface of the package. The electrode patterns are away from edges of the bottom surface of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.