Electronic parts packaging structure and method of manufacturing the same
US7217888B2 · kind B2 · utility
67Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2003 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Aug 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching stopper film (a copper film, a gold film, a silver film, or a conductive past film) as an uppermost film, and mounted on the mounted body to direct the connection pad upward, an interlayer insulating film for covering the electronic parts, a via hole formed in the insulating film on the connection pad of the electronic parts, and a wiring pattern connected to the connection pad via the via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.