Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels
US7218519B2 · kind B2 · utility
13Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2004 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Jun 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.