Heterogeneous thermal interface for cooling
US7219713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Jan 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.