Thin wafer insert
US7219802B2 · kind B2 · utility
6Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2002 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Oct 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/832
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods of supporting the thin wafers as provided by the insert and the wafer carrier. The insert (20), in preferred embodiments, utilize tabs (80, 82) that fit into the side wall recesses (53) and have an interference fit in said recesses to secure the insert in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.