Tilted land grid array package and socket, systems, and methods
US7220132B2 · kind B2 · utility
0Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A electrical interface for an electronic package, using lands on the package which are non-planar with metal layers within the package. This non-planar or tilted land grid array (TLGA) package is assembled with a complementary TLGA socket to make electronic connection to the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.