Michael Walk
17Patents
6h-index
18Co-inventors
59Inventor score
Filing activity: Jun 29, 2000 → Sep 16, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6388207B1 | Electronic assembly with trench structures and methods of manufacture | Electricity | 141 | Expired |
| US6407929B1 | Electronic package having embedded capacitors and method of fabrication therefor | Emerging Cross-Sectional Technologies | 110 | Expired |
| US6477034B1 | Interposer substrate with low inductance capacitive paths | Electricity | 68 | Expired |
| US7371975B2 | Electronic packages and components thereof formed by substrate-imprinting | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7042077B2 | Integrated circuit package with low modulus layer and capacitor/interposer | Electricity | 19 | Expired |
| US6483692B2 | Capacitor with extended surface lands and method of fabrication therefor | Electricity | 18 | Expired |
| US6899815B2 | Multi-layer integrated circuit package | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7335979B2 | Device and method for tilted land grid array interconnects on a coreless substrate package | Electricity | 2 | Expired |
| US7594321B2 | Substrate-imprinting methods | Emerging Cross-Sectional Technologies | 1 | Active |
| US7637008B2 | Methods for manufacturing imprinted substrates | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7589414B2 | I/O Architecture for integrated circuit package | Electricity | 1 | Active |
| US10347590B2 | Leadframe for a semiconductor component | Electricity | 0 | Active |
| US6897556B2 | I/O architecture for integrated circuit package | Electricity | 0 | Expired |
| US7220132B2 | Tilted land grid array package and socket, systems, and methods | Electricity | 0 | Expired |
| US7245001B2 | Multi-layer integrated circuit package | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7329946B2 | I/O architecture for integrated circuit package | Electricity | 0 | Expired |
| US7186365B2 | Methods for forming an imprinting tool | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.