Electronic component, component mounting equipment, and component mounting method
US7220922B2 · kind B2 · utility
6Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2001 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Oct 7, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.