Method of fabricating substrates and substrates obtained by this method
US7221038B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Feb 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques are shown in which substrates having a first layer of a first material and second layer of a second material, wherein the second material is less noble than the first material, is provided by bonding the first and second layers together with an amorphous layer interposed there between. The amorphous material may be deposited on a bonding face of the first layer, second layer, or both, before the operation of bonding the first and second layers. The layer with less noble material may be a supporting layer and the other layer may be an active layer for forming components in optics, electronics, or opto-electronics. The amorphous layer may be polished before the bonding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.