System and method for die attach using a backside heat spreader
US7221055B2 · kind B2 · utility
3Cited by
4References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | May 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.