Surface mount MELF capacitor
US7221555B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 2, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Nov 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G9/15
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.