Defect detection using multiple sensors and parallel processing
US7221992B2 · kind B2 · utility
4Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Oct 13, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Techniques for detecting defects on semiconductor wafers are described. The techniques involve a parallel processing system wherein a data distribution system contains data distribution nodes that are interconnected by multiple data transfer paths. This configuration allows data collected by any of the detectors to be routed to any one of a plurality of processing nodes. This in turn allows a variety of defect analysis algorithms to be implemented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.