Board design aiding apparatus, board design aiding method and board design aiding program
US7222316B2 · kind B2 · utility
4Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Jun 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.