Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
US7223153B2 · kind B2 · utility
2Cited by
20References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 21, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Apr 21, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.