Inopla Inc.
5Patents
1Active
5Granted
29Portfolio score
Filing activity: Jan 27, 2004 → Feb 28, 2007 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7364496B2 | Polishing head for polishing semiconductor wafers | Performing Operations; Transporting | 7 | Active |
| US7223153B2 | Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces | Performing Operations; Transporting | 2 | Expired |
| US7374471B2 | Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups | Electricity | 1 | Expired |
| US7367866B2 | Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups | Performing Operations; Transporting | 1 | Expired |
| US7238614B2 | Methods for fabricating one or more metal damascene structures in a semiconductor wafer | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.