Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US7223319B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 25, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Mar 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus includes: a peeling mechanism to peel a pressure sensitive adhesive (PSA) tape from a semiconductor wafer constituted by a plurality of semiconductor chips which are separated therefrom, the semiconductor wafer having an element formation surface to form an element thereon and a rear surface opposite to the element formation surface, the PSA tape adhering to the element formation surface of the semiconductor wafer, each of the semiconductor chips having an adhesive layer formed on the rear surface; wherein the peeling mechanism has a sucking section which have a porous member to hold the semiconductor wafer by suction, the porous member being segmented into at least two sucking areas in the direction in which the PSA tape is peeled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.