High temperature attachment of organic molecules to substrates

US7223628B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• David F. Bocian · Riverside, US
• Jonathan S. Lindsey · Raleigh, US
• Zhiming Liu · Englewood, US
• Amir A. Yasseri · Mountain View, US
• Veen Misra · Raleigh, US
• Qian Zhao · Changchun, CN
• Qiliang Li · Fairfax, US
• Shyam Surthi · Boise, US
• Robert S. Loewe · Morrisville, US

Key dates

• Filing date: Dec 19, 2003
• Grant date: May 29, 2007
• Expiry date: Dec 19, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E60/10
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.