Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
US7223638B2 · kind B2 · utility
5Cited by
1References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 13, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | May 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive member is placed adjacent a microelectronic die with a thermal interface material between the microelectronic die and a wetting layer formed on a surface of the thermally conductive member. The thermal interface material is heated to cause reflow thereof. The first portion of the thermal interface material is directed by the wetting layer into a first cavity formed in the thermally conductive member. The thermal interface material is then allowed to cool and solidify.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.