Printed wiring board and method of fabricating the same
US7223687B1 · kind B1 · utility
16Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2006 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Aug 21, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a printed wiring board comprising the following steps is provided. A portion of each of two dielectric layers or metal layers bonds to both sides of a carrier plate, respectively. Two build-up wiring structures are respectively formed on the dielectric layers or the metal layers by a build-up process. The portions of the dielectric layers or metal layers bonded to the carrier plate are removed such that the dielectric layers or metal layers and the build-up wiring structures formed thereon are released from the carrier plate to form two printed wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.