Method for improving selectivity of electroless metal deposition
US7223694B2 · kind B2 · utility
2Cited by
26References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jun 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/288
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of depositing a metal cladding on conductors in a damascene process is described. The potential between, for instance, cobalt ions in electroless solution and the surface of an ILD between the conductors is adjusted so as to repel the metal from the ILD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.