Chip package with embedded panel-shaped component
US7224062B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2005 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jun 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip is disposed on the first surface of the panel-shaped component, and the chip has a plurality of first pads on the active surface thereof away from the panel-shaped component. The interconnection structure is disposed on the first surface of the panel-shaped component and the active surface of the chip. The first pads of the chip may electrically connect with the electrical terminals of the panel-shaped component through the interconnection structure. Furthermore, the interconnection structure has a plurality of second pads on the surface away from the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.