Interfaces between semiconductor circuitry and transpinnor-based circuitry
US7224566B2 · kind B2 · utility
7Cited by
42References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jul 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/0175
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Electronic systems are described including semiconductor circuitry characterized by first signals and all-metal circuitry characterized by second signals and comprising a plurality of transpinnors. Each transpinnor includes a network of thin-film elements. At least one thin-film element in each transpinnor exhibits giant magnetoresistance. Each transpinnor includes a conductor inductively coupled to the at least one thin-film element for controlling operation of the transpinnor. Interface circuitry connects the semiconductor circuitry to the all-metal circuitry and converts between the first signals and the second signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.