Multi-channel temperature control system for semiconductor processing facilities
US7225864B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Apr 6, 2021 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25D31/005
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A temperature control system for a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules that separately control temperatures of multiple process components. The temperature control modules are near process components and include a circulation loop for cooling fluid from the common cooling unit and a circulation loop for a heat transfer fluid received from a component. A heat exchanger within the temperature control module allows heat transfer between heat transfer fluid and cooling fluid, thereby cooling the component. A heat source may also be within the temperature control module to heat the heat transfer fluid and the component. The cooling unit may be a refrigeration unit that provides compressed refrigerant to the temperature control modules which may include an upstream thermal expansion valve and a downstream refrigerant flow control valve that form an evaporation chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.