Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes
US7226531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2005 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Dec 12, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanotubes, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline. Alternatively, a method of the present invention includes preparing a dispersion of carbon nanotubes dispersed in an organic solvent, printing a baseline with the dispersion on a surface of a substrate, evaporating the organic solvent to obtain a conductive baseline, and electroplating the surface in an electroplating bath containing a metal ion, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.