Optoelectronic component having a plurality of current expansion layers and method for producing it

US7227191B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Franz Eberhard · Kilchberg, CH
• Uwe Strauss · Bad Abbach, DE
• Ulrich Zehnder · Regensburg, DE
• Andreas Weimar · Regensburg, DE
• Raimund Oberschmid · Sinzing, DE

Key dates

• Filing date: May 2, 2005
• Grant date: Jun 5, 2007
• Expiry date: Jul 20, 2025

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/947

Abstract

An optoelectronic component having a semiconductor chip containing a semiconductor layer sequence (6) with a radiation-emitting active zone (4), the semiconductor layer sequence (6) having sidewalls (10). A connection contact (9) is provided for impressing current into the active zone. A first current expansion layer (7) adjoins a semiconductor layer (5) of the semiconductor layer sequence (6) and a second current expansion layer (8) is provided between the semiconductor layer sequence (6) and the connection contact (9). The first current expansion layer (7) has a larger sheet resistance than the second current expansion layer (8) and forms an ohmic contact with the adjoining semiconductor layer (5). The second current expansion layer (8) is applied to a partial region of the first current expansion layer (7) which is at a distance from the sidewalls (10).