Method and apparatus for immersion lithography
US7230681B2 · kind B2 · utility
5Cited by
5References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2004 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Apr 16, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70808
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus for holding a wafer and a method for immersion lithography. The apparatus, including a wafer chuck having a central circular vacuum platen, an outer region, and a circular groove centered on the vacuum platen, a top surface of the vacuum platen recessed below a top surface of the outer region and a bottom surface of the groove recessed below the top surface of the vacuum platen; one or more suction ports in the bottom surface of the groove; and a hollow toroidal inflatable and deflatable bladder positioned within the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.