Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
US7232994B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 5, 2005 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | Aug 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a standard test device used for testing a hole of a semiconductor device. The standard test device has a structure which comprises: at least a dummy film on a base surface; at least an insulating layer which has at least one opening penetrating through the insulating layer, so that a part of a top surface of the at least dummy film is shown through the at least one opening, wherein the at least dummy film has a predetermined constant thickness at least around the at least one opening. The standard test device makes it easily possible to determine or measure a thickness of a residual film on a bottom of the contact hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.