Fab Solutions, Inc.
24Patents
0Active
24Granted
32Portfolio score
Filing activity: Nov 30, 1999 → Aug 5, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6768324B1 | Semiconductor device tester which measures information related to a structure of a sample in a depth direction | Electricity | 97 | Expired |
| US6683308B2 | Method and apparatus for measuring thickness of thin film | Electricity | 45 | Expired |
| US6559662B1 | Semiconductor device tester and semiconductor device test method | Physics | 25 | Expired |
| US6614244B2 | Semiconductor device inspecting apparatus | Physics | 18 | Expired |
| US6897440B1 | Contact hole standard test device | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6614050B1 | Semiconductor manufacturing apparatus | Electricity | 13 | Expired |
| US6946857B2 | Semiconductor device tester | Electricity | 12 | Expired |
| US6809534B2 | Semiconductor device test method and semiconductor device tester | Physics | 11 | Expired |
| US6975125B2 | Semiconductor device tester | Electricity | 9 | Expired |
| US7321805B2 | Production managing system of semiconductor device | Electricity | 8 | Expired |
| US6850079B2 | Film thickness measuring apparatus and a method for measuring a thickness of a film | Electricity | 7 | Expired |
| US6940296B2 | Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6943043B2 | Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device | Electricity | 4 | Expired |
| US6711453B2 | Production managing system of semiconductor device | Electricity | 4 | Expired |
| US6967327B2 | Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6753194B2 | Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device | Electricity | 2 | Expired |
| US7049834B2 | Semiconductor device test method and semiconductor device tester | Physics | 2 | Expired |
| US7002361B2 | Film thickness measuring apparatus and a method for measuring a thickness of a film | Electricity | 2 | Expired |
| US6982418B2 | Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6842663B2 | Production managing system of semiconductor device | Electricity | 2 | Expired |
| US6914444B2 | Semiconductor device test method and semiconductor device tester | Physics | 2 | Expired |
| US6900645B2 | Semiconductor device test method and semiconductor device tester | Physics | 2 | Expired |
| US7232994B2 | Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6837936B2 | Semiconductor manufacturing device | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.