Method of protecting wafer front pattern and method of performing double-sided process
US7235185B2 · kind B2 · utility
2Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2005 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Nov 7, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/928
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.