Touch Micro-System Technology Corp.
45Patents
37Active
45Granted
51Portfolio score
Filing activity: Oct 12, 2004 → Oct 15, 2012 · 36 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7008821B1 | Method of forming a wafer backside interconnecting wire | Electricity | 12 | Expired |
| US7392687B2 | Method of calibrating zero offset of a pressure sensor | Emerging Cross-Sectional Technologies | 11 | Active |
| US7514287B2 | Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS device | Performing Operations; Transporting | 9 | Active |
| US7732233B2 | Method for making light emitting diode chip package | Electricity | 6 | Active |
| US8456724B2 | Biaxial scanning mirror for image forming apparatus | Physics | 6 | Active |
| US7533564B2 | Micro sample heating apparatus and method of making the same | Performing Operations; Transporting | 5 | Active |
| US7585417B2 | Method of fabricating a diaphragm of a capacitive microphone device | Electricity | 4 | Active |
| US7258806B1 | Method of fabricating a diaphragm of a capacitive microphone device | Electricity | 4 | Active |
| US7598125B2 | Method for wafer level packaging and fabricating cap structures | Electricity | 4 | Active |
| US7505118B2 | Wafer carrier | Physics | 4 | Expired |
| US7262078B2 | Method of forming a wear-resistant dielectric layer | Electricity | 4 | Expired |
| US7741772B2 | White LED package structure having a silicon substrate and method of making the same | Electricity | 4 | Active |
| US7297610B2 | Method of segmenting a wafer | Electricity | 3 | Active |
| US7306955B2 | Method of performing a double-sided process | Performing Operations; Transporting | 3 | Expired |
| US7528000B2 | Method of fabricating optical device caps | Electricity | 3 | Active |
| US7235185B2 | Method of protecting wafer front pattern and method of performing double-sided process | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7395706B2 | Micro sample heating apparatus and method of making the same | Physics | 2 | Active |
| US7795131B2 | Method of fabricating metal interconnects and inter-metal dielectric layer thereof | Electricity | 2 | Active |
| US7510947B2 | Method for wafer level packaging and fabricating cap structures | Electricity | 2 | Active |
| US7361284B2 | Method for wafer-level package | Electricity | 1 | Active |
| US8310328B2 | Planar coil and method of making the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7413963B2 | Method of edge bevel rinse | Emerging Cross-Sectional Technologies | 1 | Active |
| US7393784B2 | Method of manufacturing suspension structure and chamber | Performing Operations; Transporting | 1 | Active |
| US8129206B2 | Light emitting diode package and method of making the same | Electricity | 1 | Active |
| US7456043B2 | Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereof | Performing Operations; Transporting | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.