Aqueous phosphoric acid compositions for cleaning semiconductor devices
US7235188B2 · kind B2 · utility
14Cited by
19References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2003 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Apr 12, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to dilute aqueous solutions containing phosphoric acid and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The solution according to the invention may advantageous contain an alkaline compound, one or more other acid compounds, and/or a fluoride-containing compound and may optionally contain additional components such as organic solvents, chelating agents, amines, and/or surfactants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.