Semiconductor facility
US7235992B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2005 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Jun 7, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/286
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor facility. The semiconductor facility comprises a printed circuit board (PCB), a heat source, and an adjusting device. The PCB comprises a first surface and a second surface. The heat source provides heat for a first fluid around the PCB to steadily heat up the PCB. The temperature of the first surface is adjusted to be lower than that of the second surface by the adjusting device such that the PCB is rapidly deformed to a stable state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.