Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same
US7237561B2 · kind B2 · utility
4Cited by
8References
10Claims
0Family size
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Key dates
| Filing date | Oct 16, 2003 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | May 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus for cleaning a semiconductor wafer and method for cleaning a wafer using the same wherein, the apparatus includes a chamber on which a wafer is mounted, a revolving chuck mounted in the chamber for supporting and fixing the wafer, a nozzle for spraying cleaning solution onto the wafer, a cover for covering an upper part of the chamber, and a light source. The cleaning solution, preferably one of ozone water, hydrogen water, or electrolytic-ionized water, may be heated for a short time and used to clean the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.