Heating element movement bonding method for semiconductor components
US7238919B2 · kind B2 · utility
10Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2006 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Feb 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.