Integrated heat spreader and method for using
US7239517B2 · kind B2 · utility
12Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2005 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Jan 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1616
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated heat spreader and die coupled with solder. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.