Mukul Renavikar
17Patents
6h-index
20Co-inventors
62Inventor score
Filing activity: Mar 31, 2004 → Jun 25, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7239517B2 | Integrated heat spreader and method for using | Electricity | 12 | Expired |
| US8701281B2 | Substrate metallization and ball attach metallurgy with a novel dopant element | Emerging Cross-Sectional Technologies | 9 | Active |
| US7700476B2 | Solder joint reliability in microelectronic packaging | Emerging Cross-Sectional Technologies | 8 | Active |
| US8733620B2 | Solder deposition and thermal processing of thin-die thermal interface material | Electricity | 7 | Active |
| US7183641B2 | Integrated heat spreader with intermetallic layer and method for making | Electricity | 6 | Expired |
| US8409929B2 | Forming a semiconductor package including a thermal interface material | Electricity | 6 | Active |
| US7485495B2 | Integrated heat spreader with intermetallic layer and method for making | Electricity | 3 | Active |
| US8030757B2 | Forming a semiconductor package including a thermal interface material | Electricity | 3 | Active |
| US11817364B2 | BGA STIM package architecture for high performance systems | Electricity | 2 | Active |
| US7553702B2 | Integrating a heat spreader with an interface material having reduced void size | Electricity | 2 | Active |
| US9613933B2 | Package structure to enhance yield of TMI interconnections | Electricity | 1 | Active |
| US8018063B2 | Solder joint reliability in microelectronic packaging | Emerging Cross-Sectional Technologies | 0 | Active |
| US10049971B2 | Package structure to enhance yield of TMI interconnections | Electricity | 0 | Active |
| US8436470B2 | Solder joint reliability in microelectronic packaging | Emerging Cross-Sectional Technologies | 0 | Active |
| US7205595B2 | Polymer memory device with electron traps | Electricity | 0 | Expired |
| US7087521B2 | Forming an intermediate layer in interconnect joints and structures formed thereby | Electricity | 0 | Expired |
| US9394619B2 | Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.