Printed circuit board and method of reducing crosstalk in a printed circuit board
US7239526B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 2, 2004 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Oct 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one embodiment of the present invention comprises a first row of vias and a second row of vias, each having a plurality of signal vias. The circuit board also comprises a plurality of rows of vias being coupled to a ground plane between the first row of signal vias and the second row of signal vias. According to one embodiment, the plurality of rows of vias being coupled to a ground plane comprise rows of vias having different sizes. Some of the vias are designed to receive a component, while others are generally smaller and designed to provide a return current path for the signal vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.