Method for analyzing material density variations on a multi-layer printed circuit board
US7240313B2 · kind B2 · utility
0Cited by
21References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Apr 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for determining material density variations and prediction of defects on a multi-layer printed circuit board (PCB), in the X, Y, and Z axis, includes a virtual grid creation system and a set of rules for determining the material density in each grid element in the grid system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.