Apparatus for semiconductor chip detachment
US7240422B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2004 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Dec 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.